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Power chips are attached to external circuits through packaging, and their performance relies on the support of the product packaging. In high-power scenarios, power chips are usually packaged as power components. Chip affiliation refers to the electric link on the top surface area of the chip, which is normally aluminum bonding cable in conventional modules. ^
Conventional power component plan cross-section

At present, commercial silicon carbide power modules still mainly utilize the packaging innovation of this wire-bonded conventional silicon IGBT component. They face issues such as big high-frequency parasitical specifications, inadequate warmth dissipation capacity, low-temperature resistance, and insufficient insulation strength, which limit the use of silicon carbide semiconductors. The display of excellent efficiency. In order to resolve these troubles and fully make use of the big possible benefits of silicon carbide chips, many new packaging technologies and solutions for silicon carbide power components have actually emerged in recent years.

Silicon carbide power module bonding technique

(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding products have established from gold cord bonding in 2001 to aluminum wire (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have established from gold cords to copper wires, and the driving force is cost decrease; high-power gadgets have actually developed from light weight aluminum cables (strips) to Cu Clips, and the driving force is to enhance product performance. The better the power, the higher the needs.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging process that uses a solid copper bridge soldered to solder to link chips and pins. Compared with conventional bonding packaging approaches, Cu Clip modern technology has the complying with benefits:

1. The link in between the chip and the pins is made from copper sheets, which, to a particular degree, replaces the typical cable bonding approach between the chip and the pins. Therefore, an unique bundle resistance worth, higher current flow, and better thermal conductivity can be acquired.

2. The lead pin welding area does not need to be silver-plated, which can fully save the expense of silver plating and inadequate silver plating.

3. The item appearance is completely regular with regular products and is mostly made use of in web servers, mobile computers, batteries/drives, graphics cards, motors, power supplies, and various other areas.

Cu Clip has 2 bonding techniques.

All copper sheet bonding method

Both the Gate pad and the Resource pad are clip-based. This bonding technique is a lot more pricey and complex, but it can achieve better Rdson and better thermal impacts.

( copper strip)

Copper sheet plus cable bonding approach

The source pad utilizes a Clip technique, and the Gate makes use of a Cord method. This bonding approach is somewhat cheaper than the all-copper bonding method, saving wafer area (relevant to very little gate locations). The procedure is less complex than the all-copper bonding technique and can get far better Rdson and much better thermal result.

Distributor of Copper Strip

TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding legend mining hot copper, please feel free to contact us and send an inquiry.

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